Poly-Bond® B55

 

Poly-Bond B55 is white, low-density, polyester-based compound designed to function as a laminating resin as well as a gap filling compound. At a weight of 1/3 less than polyester resin, and when combined with a sandwich core, it achieves low weight sandwich parts with a good profile such as hatches, doors, tabletops, centerboards, rudders, and a variety of small parts where low weight and a gelcoated surface on both sides is important. Such parts are produced in a one-step molding process with low cost tooling. Poly-Bond B55 has an excellent flow with low closing pressures obtained when the mold halves are clamped together. Poly-Bond B55 is catalysed with MEKP, and has a short gel time with fast follow-through for short production cycles. It can be used in bond-line thicknesses up to 1” (25mm). PLEASE CONTACT US FOR POLY-BOND B55/B55LV PROCESS INSTRUCTIONS

Produkt

Dichte in g/m 2

Viskosität/mPas

Fugenstärke

Größe

Härter

Artikelnummer

B55 Poly-Bond

0,68-0,72

110000-120000

1-20

19 Liter/14,4 Kg

MEKP

B55LVRC

 

 

Contact us

CTM GmbH - Composite Technologie & Material
Maria-Goeppert-Mayer Straße 2
24837 Schleswig - GERMANY
fon: +49 (0) 4621 95533
fax: +49 (0) 4621 95535
info@ctmat.de

Opening hours

You are welcome:

  • Monday-Thursday:
    8:00 am - 4:30 pm
  • Friday:
    8:00 am - 3:00 pm